发明名称 |
Copper plated PTH barrels and methods for fabricating |
摘要 |
A circuitized semiconductor substrate comprising a layer of dielectric material having holes therethrough, a catalyst seed layer lining the walls of the holes along the surface of the dielectric material, and a nickel layer in the openings and a layer of copper above the nickel layer, along with a method for its fabrication. The invention also provides copper-nickel laminate PTH barrels and methods for their fabrication. |
申请公布号 |
US2002195716(A1) |
申请公布日期 |
2002.12.26 |
申请号 |
US20010795332 |
申请日期 |
2001.02.27 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
MAGNUSON ROY H.;MARKOVICH VOYA R.;MILLER THOMAS R.;WOZNIAK MICHAEL |
分类号 |
H01L21/48;H01L23/498;H05K3/10;H05K3/42;(IPC1-7):H01L23/48 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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