发明名称 Copper plated PTH barrels and methods for fabricating
摘要 A circuitized semiconductor substrate comprising a layer of dielectric material having holes therethrough, a catalyst seed layer lining the walls of the holes along the surface of the dielectric material, and a nickel layer in the openings and a layer of copper above the nickel layer, along with a method for its fabrication. The invention also provides copper-nickel laminate PTH barrels and methods for their fabrication.
申请公布号 US2002195716(A1) 申请公布日期 2002.12.26
申请号 US20010795332 申请日期 2001.02.27
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 MAGNUSON ROY H.;MARKOVICH VOYA R.;MILLER THOMAS R.;WOZNIAK MICHAEL
分类号 H01L21/48;H01L23/498;H05K3/10;H05K3/42;(IPC1-7):H01L23/48 主分类号 H01L21/48
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