| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device and a method for manufacturing the same whereby manufacturing can be performed in a small number of steps without limiting a gap between electronic components to be joined. SOLUTION: First, electrode pads 6 and 3 are formed respectively on semiconductor chips 1 and 2. Then, epoxy resin containing Ag is printed and formed on the electrode pad 3 on the semiconductor chip 2. Subsequently, bumps 4 are formed by curing the epoxy resin formed on the electrode pad 3. Thereafter, a conductive jointing material is printed and formed so as to cover the electrode pad 3. Then, the semiconductor chip 1 and the semiconductor chip 2 are opposed to each other in such a way that the electrode pad 6 and the corresponding bumps 4 are in contact with each other and the conductive jointing material is in contact with the electrode pad 6. Thereafter, the conductive jointing material is cured to serve as a joint 5, so that the semiconductor chip 1 and the semiconductor chip 2 are joined to each other via the bumps 4. |
