发明名称 FLOOR STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a floor structure capable of effectively reducing a width warp, a difference in level, or a joint gap due to floor heating heat. SOLUTION: The floor structure 11 arranging a floor heating surface floor board 15 on a backing plywood 13 via a sound insulating sheet 14 is characterized by that the sound insulating sheet 14 comprises an asphalt sound insulator and a thermal deformation rate is <=1%.
申请公布号 JP2002371703(A) 申请公布日期 2002.12.26
申请号 JP20010182319 申请日期 2001.06.15
申请人 CCI CORP 发明人 KOBAYASHI KOJI;KO YOSEI
分类号 E04F15/18;F24D3/16;(IPC1-7):E04F15/18 主分类号 E04F15/18
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