SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

摘要

PROBLEM TO BE SOLVED: To improve loading accuracy and to provide a semiconductor device using a finer semiconductor chip at a low cost. SOLUTION: The semiconductor chip 101 is made to face a substrate 104a in the state of being kept stuck to a dicing tape 501, pressed by collets 601 and 602 and joined. Thus, the need for inverting the chip is eliminated and the semiconductor device using the fine semiconductor chip is manufactured at a low cost.