| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed board, capable of simplifying manufacturing steps, even in the case of a printed substrate obtained by laminating a resin base on a ceramic substrate, and to provide a method for manufacturing the same. SOLUTION: The method for manufacturing the printed board comprises the steps of forming a conductor pattern 22 on a resin film 23 made of a thermoplastic resin, laminating (Fig. (f)) a one-side conductor pattern film 21, having a conductive paste 50 in a via hole 24 and the ceramic substrate 31 having a printed conductor pattern 32 and a printed resistor 33, then hot pressing from both surfaces, to obtain the printed board 100 (Fig. (g)). In this case, the film 21 and the substrate 31 are bonded to each other, and the patterns 22 are interlayer connected therebetween, and the pattern 22 and the pattern 32 are interlayer connected. |
