STRUCTURE OF LEAD TERMINAL

摘要

PROBLEM TO BE SOLVED: To provide a lead terminal structure in which, using a lead-free soldering flux having a melting range and a high melting temperature, lead terminals are soldered in place by insertion into through holes provided in a base and each having lands on its upper and lower surfaces, and which is capable of preventing separation at the joint between a solder fillet and the land during setting of the solder. SOLUTION: Anti-spread parts 12 and 17 for preventing molten solder from spreading while wetting the surfaces of the lead terminals 11 and 16 are provided in the positions of the lead terminals 11 and 16 which are a predetermined distance above and away from surfaces mounted to a base 1. The anti-spread parts 12 and 17 can be oxidized films, plating films, or bulges of the terminals. The spreading of the molten solder wetting the surfaces of the lead terminals 11 and 16 can be prevented also by providing the lead terminals with heat radiation inhibiting parts capable of delaying the setting of the solder near the lead terminals.