发明名称 Process for low temperature atomic layer deposition of Rh
摘要 A method for the formation of rhodium films with good step coverage is disclosed. Rhodium films are formed by a low temperature atomic layer deposition technique using a first gas of rhodium group metal precursor followed by an oxygen exposure. The invention provides, therefore, a method for forming smooth and continuous rhodium films which also have good step coverage and a reduced carbon content.
申请公布号 US2002197814(A1) 申请公布日期 2002.12.26
申请号 US20010884997 申请日期 2001.06.21
申请人 发明人 MARSH EUGENE P.;UHLENBROCK STEFAN
分类号 C23C16/04;C23C16/18;C23C16/44;C23C16/455;H01L21/02;H01L27/108;(IPC1-7):H01L21/20;H01L21/824 主分类号 C23C16/04
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