Photonic device packaging method and apparatus

摘要

A photonic device package, the assembly and manufacturing methods thereof are provided. The package may be mounted to a substrate such as a PC board in a novel and inventive technique that allows several orientations, whereby a system designer has an increased flexibility in designing a module or system that includes a photonic device. The photonic device package is designed to be fabricated, handled, manufactured and tested by methods that take advantage of semiconductor industry standards.