发明名称 COOLING MECHANISM OF ENCLOSED INFORMATION PROCESSOR
摘要 <p>PROBLEM TO BE SOLVED: To provide an enclosed information processor wherein the inside of a housing can be cooled efficiently and heat generated in the housing and from the cooling section can be dissipated efficiently. SOLUTION: A radiator in the housing is cooled by means of a Peltier element and the inside of the housing is cooled by means of a fan for circulating air in the housing through a radiator. Consequently, cooling effect can be enhanced in a state where the housing is enclosed. Heat on the heat generating side of the Peltier element is released to a heat sink provided on the outside of the housing and a fan for cooling the heat sink is provided on the outside of the housing. Efficient cooling can be realized by discharging heat generated from the Peltier element at the cooling section of an enclosed information processor.</p>
申请公布号 JP2002374085(A) 申请公布日期 2002.12.26
申请号 JP20010181021 申请日期 2001.06.15
申请人 HITACHI LTD;HITACHI ASAHI ELECTRONICS CO LTD 发明人 TSUKADA SHIGEO;IMAI NAOKI;NAITO MICHINORI;SAKANO HIROKI
分类号 G06F1/20;H01L35/28;H05K7/20;(IPC1-7):H05K7/20 主分类号 G06F1/20
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