| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and an apparatus for inexpensively flattening an interlayer/intralayer insulating film on a semiconductor wafer with a large throughput and simple processes. SOLUTION: To flatten an interlayer/interalayer insulating film on a semiconductor wafer (14), a method and an apparatus (10 and 50) are provided. The method includes a step for providing a furnace (12) having a wafer holder (26) at the inside, a step for arranging the semiconductor wafer (14) on the wafer holder (26), and a step for simultaneously applying mechanical pressure and heat to the interlayer/interalayer insulating film on the semiconductor wafer (14) by using apparatus (16 and 56).
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