| 摘要 |
PROBLEM TO BE SOLVED: To provide a protective fixture for lead parts of a semiconductor device for preventing deformation of the lead parts and notably reducing time for a test in the solder heat test. SOLUTION: The protective fixture for the lead parts for mounting the semiconductor device is equipped with dish-like seating and axial bars. The dish-like seating is substantially in quadrangle shape and has rising edge parts. The axial bars extend from four corners of the seating at approximate 45 degrees to neighboring sides and comprise inclined parts and horizontal parts. In the semiconductor device mounted, the leads extrude from at least two opposed sides of a molded part and extend downwardly below a bottom surface of the molded part.
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