| 摘要 |
PROBLEM TO BE SOLVED: To keep uniformity of holding of a substrate to be polished and improve precision of a polished surface. SOLUTION: A holding surface 14 making contact with the substrate 5 to be polished and a polishing head 12 having a number of ventilation small holes 15 formed through in the holding surface keeping a regular small distance are situated between a top ring body 2 and the substrate 5 to be polished. |
