TWO-SURFACE MACHINING METHOD FOR WAFER AND ITS DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a two-surface machining method for a wafer and its device capable of improving machining accuracy of a large diameter wafer. SOLUTION: A pair of surface plates 15 and 16 having a diameter smaller than the wafer W are oppositely arranged on both the obverse and reverse of the wafer W, and while sandwiching both sides of the wafer W rotatably supported by a wafer holding mechanism 17 by the surface plates 15 and 16, the surface plates 15 and 16 are rotated (an arrow K) in the circumferential direction, and the wafer W is simultaneously machined on both surfaces. At this time, the wafer W is vertically reciprocated (an arrow B) relative to the surface plates 15 and 16.