发明名称 MOLD APPARATUS FOR MOLDING AND METHOD FOR CONTROLLING ITS TEMPERATURE
摘要 PROBLEM TO BE SOLVED: To manage a product cavity at a preferable temperature according to a position from a gate. SOLUTION: A mold apparatus for molding comprises a plurality of temperature regulating liquid passages 102, 102A, 102B, 102C, 102D and 102E around a product cavity 3 long in a mold opening/closing direction. The apparatus further comprises liquid temperature regulating means 112, 112A, 112B, 112C, 112D and 112E for regulating temperatures of the passages 102, 102A, 102B, 102C, 102D and 102E, respectively. Thus, temperatures of liquids flowing through the passages 102, 102A, 102B, 102C, 102D and 102E can be respectively regulated by the plurality of the means 112, 112A, 112B, 112C, 112D and 112E.
申请公布号 JP2002370265(A) 申请公布日期 2002.12.24
申请号 JP20010184044 申请日期 2001.06.18
申请人 MITSUBISHI MATERIALS CORP 发明人 HORIKAWA YOSHIHIRO;UENO HIROSHI
分类号 B29C45/73;B29C33/04;B29C45/26;(IPC1-7):B29C45/73 主分类号 B29C45/73
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