发明名称 |
Heat dissipation in electrical apparatus |
摘要 |
The invention relates to the provision of a cooling effect on components (6) of electrical apparatus which are mounted on an upper surface (8) of a printed circuit board (4) within a housing (2). The invention provides for the mounting of a material layer (12) which can absorb or otherwise dissipate heat and the invention allows the mounting of the said material (12) beneath the printed circuit board (4) within the housing (2) in position to provide improved cooling effect without contacting the components (6) themselves.
|
申请公布号 |
US6498726(B2) |
申请公布日期 |
2002.12.24 |
申请号 |
US20000737203 |
申请日期 |
2000.12.14 |
申请人 |
PACE MICRO TECHNOLOGY PLC |
发明人 |
FULLER COLIN;BRISTOW ANTHONY;CROSS STEPHEN;WOODHOUSE DAVID;STURGE DAVID |
分类号 |
H01L23/367;H05K7/20;(IPC1-7):H05K7/20 |
主分类号 |
H01L23/367 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|