LED chip, LED array chip, LED array head and image-forming apparatus

摘要

There is disclosed an LED array chip which can minimize LED optical property deterioration by addition of a surface protective film, and mainly side effects such as light quantity decrease and light quantity dispersion increase among light emitting bits. In the LED array chip comprising a plurality of LED light emitting elements arrayed in a row, a surface insulating film formed by the same material as a material of an inner-layer insulating film for forming a window to connect a wiring pattern in an internal electric circuit constitution and for establishing electric insulation between circuits and by the same thin film forming process as a process of the inner-layer insulating layer is formed in an thickness of 0.5 mum or less on the entire surface of a final surface layer excluding a wire bonding pad and including a light emitting portion surface.