| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method for controlling high frequency fusion bonding so as to certainly perform fusion bonding regardless of various changes in factor causing fusion bonding failure, and a high frequency fusion bonding apparatus for performing fusion bonding by utilizing the control method. SOLUTION: In the method for controlling high frequency fusion bonding, a change in the distance between two molds holding articles to be fusion-bonded is detected by the value of a current flowing to a circuit and a fusion bonding time is controlled on the basis of the detected current value. The high frequency fusion bonding apparatus using this control method is also disclosed.</p> |
