Apparatus and method for measuring wafer clamping tension

摘要

A wafer clamping tension measuring apparatus includes a base plate having a guide groove formed in an upper surface and a moving plate having a guide rail protruding from a lower surface and reciprocating with the guide groove. A tension gauge is fixed to an upper surface of the moving plate for measuring the tension of a wafer clamping elastic member confronting the tension gauge. A displacement restricting block is attached at one end of the base plate nearest to the wafer clamping elastic member to restrict the movement of the moving plate relative to the base plate when the moving plate is displaced towards the displacement restricting block.