| 发明名称 |
A circuit encapsulation technique utilizing electroplating |
| 摘要 |
A novel technology is provided for encapsulating electronics for use in harsh media applications, such as biomedical implants. The present invention includes electroplating a metal film on top of an insulating layer to hermetically seal an electronic system, microstructure, or micro device. |
| 申请公布号 |
AU2002313631(A1) |
申请公布日期 |
2002.12.23 |
| 申请号 |
AU20020313631 |
申请日期 |
2002.06.05 |
| 申请人 |
THE REGENTS OF THE UNIVERSITY OF MICHIGAN |
发明人 |
BRIAN STARK;KHALIL NAJAFI |
| 分类号 |
B81B7/00;H01L23/31;(IPC1-7):B81B7/00;H01L23/29;H01L23/10 |
主分类号 |
B81B7/00 |
| 代理机构 |
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| 主权项 |
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