| 摘要 |
PURPOSE: An integrated circuit and fine working system are provided to easily form wide-gap spacing between the bonded substrates. CONSTITUTION: An etched surface of the substrate(10) is a predetermined depth(12) from the non-etched surface of the substrate. Anisotropic etching preferably forms the predetermined depth(12) alone. The etched surface of substrate(10) has disposed on the fabricated thin-film layers(20) containing circuit elements preferably arraigned by function such as logic circuits(22) and emitter array(24). During fabrication of the thin-film layers, preferably a dielectric layer(14) is deposited over the etched surface, the inclined surface and the non-etched surface of substrate(10) to provide an insulating layer for interlevel conductors(16). The gradual inclined surface is illustrated as a first incline along the edge(28) and a lesser incline along the edge(26) before interfacing with the non-etched surface of substrate(10). Again, the optional seal(30) is on the peripheral edge of the non-etched surface of substrate(10). |
