发明名称 BONDING STRUCTURE AND METHOD OF FLEXIBLE PRINTED BOARD
摘要 PROBLEM TO BE SOLVED: To provide a flexible printed board connecting structure which is capable of easily aligning a flexible printed board with another printed board and realizing the automatic assembly of a composite board composed of the printed boards easily and surely at a low cost. SOLUTION: A through-hole 5 is bored in the land 4 of a flexible printed board 1, and the diameter of the through-hole 5 is set smaller than those of through-holes bored in a cover layer and a base layer. A protuberant solder layer 8 is previously formed on a solder land 7 formed on another printed board 2, and the printed boards 1 and 2 are positioned by engaging and aligning the tip of the solder layer 8 with the through-hole 5. After the boards 1 and 2 are positioned, the solder layer 8 is melted by heating so as to feed solder through the through-hole 5 and to be soldered to the solder land 4.
申请公布号 JP2002368370(A) 申请公布日期 2002.12.20
申请号 JP20010172677 申请日期 2001.06.07
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 KATAOKA MASAHIRO
分类号 H05K1/14;H05K3/28;H05K3/36;(IPC1-7):H05K1/14 主分类号 H05K1/14
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