| 摘要 |
PROBLEM TO BE SOLVED: To enhance the degree of integration of respective components, and to simplify interconnection wirings. SOLUTION: First, second FETs 21, 22 and a third FET 23 are integrated into one package as an integrated circuit component 20, 2nd gates of the 1st and 2nd FETs 21, 22, a source of the 3rd FET 23 and a source of the 1st FET 21, a gate of the 3rd FET 23 and a 1st gate of the 2nd FET 22 are respectively connected, in terms of DC in the integrated circuit component 20; the drain of the 3rd FET 23 and the 1st gate of the 1st FET 21 are interconnected via a 1st resistor 24, AGC voltage is applied to the 2nd gate of the 1st FET 21, and the source is connected to ground.
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