| 摘要 |
PROBLEM TO BE SOLVED: To reduce production cost of a multi-chip module, in which a plurality types of chips have different terminals pitches on a wiring board. SOLUTION: With respect to two types of chips 2A and 2C which are mounted on a package substrate, the ratio of chip area to the number of terminals of the chip 2A is compared with that for the chip 2C; and the chip 2C having the small ratio is mounted by wire-bonding method, and the chip 2A having the large ration is mounted by a flip-chip method. |
