CONDUCTIVE PASTE, CONDUCTIVE BUMP USING IT, ITS FORMING METHOD, METHOD FOR CONNECTING CONDUCTIVE BUMP, CIRCUIT BOARD AND ITS PRODUCING METHOD

摘要

PROBLEM TO BE SOLVED: To obtain a conductive paste ensuring stabilized reliability of electrical connection between electrode layers through inner via holes, and to obtain a circuit board including inner via holes using that paste. SOLUTION: The conductive paste contains 80-90% by mass of metal filler having an average particle diameter in the range of 0.5-20μm, 4.48-15.3% by mass of liquid epoxy resin containing more than one epoxy group in one molecule, 0.02-1.7% by mass of thermoplastic resin powder, and 0.5-3% by mass of latent hardener wherein the viscosity is not higher than 500 Pa.s under room temperature.