发明名称 ELECTRONIC EQUIPMENT SYSTEM AND VERTICAL RACK
摘要 <p>PROBLEM TO BE SOLVED: To improve heat dissipation from servers when a plurality of thin servers are stacked in a rack. SOLUTION: In a structure in which the plurality of thin servers 101a, 101b, 101c and 101d are stacked in the rack, the individual servers are arranged while shifting each server by prescribed dimensions. An opening for heat radiation is formed at a part where each server is shifted. In such a configuration, heat radiation openings can be secured even though the thin servers are stacked in the rack, and heat dissipation from the inside of the servers can be improved.</p>
申请公布号 JP2002366258(A) 申请公布日期 2002.12.20
申请号 JP20010166376 申请日期 2001.06.01
申请人 INTERNATL BUSINESS MACH CORP <IBM> 发明人 MORI SHIGEKI;ANZAI SEITETSU;TAKEUCHI ATSUYA
分类号 G06F1/16;G06F1/20;H05K7/18;H05K7/20;(IPC1-7):G06F1/20 主分类号 G06F1/16
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