| 摘要 |
<p>PROBLEM TO BE SOLVED: To easily position a semiconductor chip and a lead frame, to eliminate need for another complicated process in soldering, and to prevent a semiconductor chip from floating when soldering in a semiconductor device connecting one surface of the semiconductor chip to that of the lead frame by soldering. SOLUTION: In the semiconductor chip, one portion is changed into a thin film from one surface of the semiconductor chip, thick and thin portions on one surface of the semiconductor chip are made a projection and a recess, respectively, a groove-like recess 25 where the projection of the semiconductor chip can be inserted is provided on one surface 21 of a lead frame 20, at least three stepped section 26 higher than the bottom of the recess 25 by one step are formed at the bottom of the recess 25 while the steps are in contact with the projection of the semiconductor chip, and height in the step 26 is set so that clearance can be formed between the bottom of the recess of the semiconductor chip and one surface 21 of the lead frame 20.</p> |
