| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for evaluating the solderability of a component, based on the heat capacity of the component from latent heat caused by the phase change of a material, and to provide a method for improving the solderability of the component applied to soldering using solder whose melting point is very high such as unleaded solder. SOLUTION: In the method for evaluating the solderability of the component, the heat capacity of the component is grasped from latent heat caused by the phase change of the material. In the soldering method of the component, the heat capacity of the component is grasped from latent heat caused by the phase change of the material and solder is heat-supplied in accordance with the heat capacity of the component at the time of soldering the component.
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