| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing mould assembly that can be improved in productivity by increasing the handled number of semiconductor packages per unit time, when the packages are discharged by cutting off the packages from the outer frames of lead frames. SOLUTION: This semiconductor device manufacturing mold assembly 10 is provided with a working means 15 which works the external leads 14 of the semiconductor packages 12, formed on continuously formed unit lead frames 11 and sent on a transport line 13 into a prescribed shape and a cutting means 17, which is provided on the downstream side of the working means 15 and discharges the semiconductor packages 12 by cutting off the packages 12 from the outer frames 16 of the lead frames 11. The cutting means 17 is provided with a mobile mould unit 32 which stores the transported semiconductor packages 12, until the stored packages 12 reaches a preset prescribed number, discharges the stored packages 12 to the outside of the line 13, by simultaneously cutting off the packages 12 from the outer frames 16 of the lead frames 11, and can be moved forward and backward.
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