SUBMOUNT AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a submount that can mount a light-emitting semiconductor device with high connection strength. SOLUTION: The submount has a submount substrate, a solder layer formed on the main surface of the submount substrate, and a solder layer where a transition element layer using at least one kind of transition element as a main constitutent and a precious metal layer using at least one kind of precious metal as a main constituent are laminated from the side of the submount substrate between the submount substrate and solder layer. The semiconductor device has a light-emitting semiconductor device mounted on the solder layer of the submount.