COMPOSITE MEMBER FOR SEMICONDUCTOR DEVICE, INSULATION- TYPE SEMICONDUCTOR DEVICE OR NON-INSULATION TYPE SEMICONDUCTOR DEVICE USING THE SAME

摘要

PURPOSE: To provide a reliable composite member for a semiconductor device, an insulation type semiconductor device or non-insulation-type semiconductor device using it, where a thermal stress or thermal strain produced at manufacturing or operation is reduced, without risk of deformation, denaturalization, or breakage of members, and which is effective for acquiring a semiconductor device of low cost. CONSTITUTION: The composite member for semiconductor device is a composite metal plate, where particles of cuprous oxide is dispersed in a copper matrix; the surface of the composite metal plate is covered with a metal layer; and a copper layer whose thickness is at least 0.5 μm is interposed in the interface constituted of the composite metal plate and the metal layer.