发明名称 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
摘要 PROBLEM TO BE SOLVED: To provide an improved semiconductor device, where variations in breakdown-strength of a gate oxide film so that characteristics such as Vth and Ids are reduced. SOLUTION: A collector region is formed on a semiconductor substrate 1. An emitter electrode 20, an external base electrode 13, and gate electrodes (34 and 14) are formed on the semiconductor substrate. The position of the interface between the gate electrodes (34 and 14) and the semiconductor substrate 1 is set higher than that between the external base electrode 13 and the semiconductor substrate 1.
申请公布号 JP2002368146(A) 申请公布日期 2002.12.20
申请号 JP20010178229 申请日期 2001.06.13
申请人 MITSUBISHI ELECTRIC CORP;RYODEN SEMICONDUCTOR SYST ENG CORP 发明人 IGARASHI TAKAYUKI;OTSU YOSHITAKA
分类号 H01L21/331;H01L21/8222;H01L21/8248;H01L21/8249;H01L27/06;H01L29/732;(IPC1-7):H01L21/824;H01L21/822 主分类号 H01L21/331
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