| 摘要 |
PROBLEM TO BE SOLVED: To provide a structure for mounting a heat dissipating part on a printed board with never causes poor solder zones on legs of an electronic component soldered even in a dip bath without raising the manufacturing cost. SOLUTION: A radiating component 2 is formed on a thin plate by providing an electronic fixing surface 2a and bends 2b, 2b,... formed by bending the fixing surface 2a, and tongues 2c, 2c,... are formed on the bends 2b, 2b,... and inserted through holes 1c, 1c,... of a printed board 1 to mount the heat dissipating part 2 on the printed board 1.
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