| 摘要 |
PROBLEM TO BE SOLVED: To realize manufacture of a thin semiconductor device without causing any cracking or chipping of a semiconductor chip. SOLUTION: A semiconductor chip C is face-down bonded to a substrate 1 and sealed with resin 5 under that state. Subsequently, the resin 5 and the non-active surface 13 side of the semiconductor chip C are ground simultaneously up to a target thickness T thus thinning the semiconductor chip C. Furthermore, the resin 5 and the substrate 1 are cut along a cut line D thus dicing pieces of semiconductor device. |
