| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device, on which multiple chips can be mounted with the reduced number of wiring layers by reducing intersecting of wirings between semiconductor chips. SOLUTION: The semiconductor chip is integrally formed, by stacking in the thickness direction and second semiconductor chips 11 and 16 having terminal surfaces 11A and 16A, which are respectively provide with terminals and first and second substrates 12 and 17, which are respectively connected o the terminals and have conductive vias 15 or via lands 15L for making electrically connectings in the thickness direction and the chips 11 and 16 are stacked with the surfaces 11A and 16A facing in directions opposite to each other, with respect to the thickness direction. |
