RESIN COMPOSITION FOR INSULATION MATERIAL, RESIN COMPOSITION FOR ADHESIVE AND ADHESION SHEET

摘要

An insulating resin composition excellent in resistance to soldering heat, characterized by containing (A) a copolymer comprising vinyl monomer units [ a] and epoxy monomer units [b] and (B) a polymerization initiator. An adhesive resin composition excellent in resistance to soldering heat, which contains (A) a copolymer comprising vinyl monomer units [a] and epoxy monomer units [ b] and (B') a cationic polymerization initiator, characterized in that the melt viscosity of the composition at 180 ~C and a shear rate of 1.2 x 102 sec-1 i s 50 to 1000 Pa s. An adhesive sheeting which is produced by laminating an adhesive resin layer [I] containing (A) a copolymer comprising vinyl monomer units [a] and epoxy monomer units [b] and (B) a polymerization initiator wit h a support layer [II] exhibiting a contact angle with water of 75~ or above o n the surface to be brought into contact with the layer [I] and in which the layer [II] is easily peelable from the layer [I].