发明名称 LIQUID-COOLED MOUNTING SYSTEM FOR INFORMATION PROCESSOR
摘要 <p>PROBLEM TO BE SOLVED: To mount a liquid-cooled mounting system which assures maintainability and expandability without drastically changing motherboards and housing of industry standard specifications and also to improve mounting efficiency. SOLUTION: This mounting system consists of a motherboard 1 and liquid cooling pumps 2, and a plurality of CPUs 3, memory modulates 4 and PCI slots 5 are mounted on the motherboard 1. Two liquid cooling tubers 6 for circulating cooling liquid are connected to the respective liquid cooling pumps 2. Since there are many vertically mounted parts on the motherboard 1, the liquid cooling pump 2 is mounted on a VRM 17 in addition to a DC/DC converter 18 for a CPU, and the power is fed from the motherboard 1 through a VRM interface 19. The liquid cooling pump 2 is mounted on a PCI card 16 and the power is fed from the motherboard 1 through a PCI slot 5.</p>
申请公布号 JP2002366260(A) 申请公布日期 2002.12.20
申请号 JP20010177915 申请日期 2001.06.13
申请人 HITACHI LTD 发明人 FUKUDA YUICHI;ICHIEDA YOSHIJI
分类号 G06F1/20;H05K7/20;(IPC1-7):G06F1/20 主分类号 G06F1/20
代理机构 代理人
主权项
地址