| 摘要 |
PROBLEM TO BE SOLVED: To enhance the yield by protecting a semiconductor chip against chipping, damaging or scattering in so-called predicing where cutting grooves not reaching the rear surface are made in the surface of a semiconductor wafer and then the cutting grooves are exposed by grinding the rear surface thus separating individual semiconductor chips. SOLUTION: A semiconductor wafer W provided, in the surface thereof, with cutting grooves is held while directing the rear surface upward on a chuck table 15a having a conical chuck face 40 and spinnable about the vertex 41 thereof. The chuck table 15a is rotated in the direction C and a grinding wheel 25 is rotated in the direction A from the vertex 41 toward the outer circumferential part 42. A grindstone piece 26a is touched to the rear surface of the semiconductor wafer W in the radius region 40a thus relaxing impact when the grindstone piece 26a touches the semiconductor wafer W. |
