CONNECTION BOARD, MULTILAYERED WIRING BOARD USING THE SAME, SEMICONDUCTOR PACKAGE BOARD, SEMICONDUCTOR PACKAGE, METHOD OF MANUFACTURING CONNECTION BOARD, METHOD OF MANUFACTURING MULTILAYER WIRING BOARD THERETHROUGH, METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE BOARD, AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE

摘要

PROBLEM TO BE SOLVED: To provide a connection board which is superior in accuracy, mechanical strength, and connection reliability, a multilayer wiring board using the same, and a method of efficiently manufacturing a semiconductor package board and a semiconductor package. SOLUTION: A connection board, a multilayer wiring board, and a semiconductor package board are manufactured through processes as follows. A board is composed of an insulating resin layer and a connection conductor. A composite metal layer is composed of a second metal layer 42 serving as a carrier and a first metal layer 41 whose removal condition is different from that of the second metal layer, and the first metal layer 41 is selectively removed for the formation of a connection conductor 13. A first insulating resin composition thin layer is formed so as to cover the side face of the connection conductor 13, and a second insulating resin layer 121 is formed on the surface of the first insulating resin composition thin layer so as to bury the connection conductor 13. After the second insulating resin layer 121 is set cured, the insulating resin is polished until the connection conductor 13 is exposed for the manufacture of the connection board, the multilayer wiring board, and the semiconductor package board.