| 摘要 |
PROBLEM TO BE SOLVED: To provide a stacked package structure for an image sensor. SOLUTION: The stacked package structure for the image sensor to be electrically connected to a printed circuit board has a printed circuit board, an integrated circuit, an image sensing chip, and a transparent layer. The board has an upper side and a lower side opposite to the upper side. A plurality of signal input terminals are formed on the upper side and a signal output terminal electrically connected to the printed circuit board is formed on the lower side. The integrated circuit is fitted on the upper side of the board and electrically connected to the signal input terminals. A package layer covers the integrated circuit to package the integrated circuit. The image sensing chip is placed on a package layer and stacked on the integrated circuit, and electrically connected to the signal input terminals of the board. The transparent layer covers the image sensing chip, which receives an image signal through the transparent layer. The manufacturing method of the image sensor is also described. Through the configuration above, the image sensing chip and the integrated circuit can easily be integrally stacked.
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