| 摘要 |
PROBLEM TO BE SOLVED: To provide a cooling device having a configuration for suppress thermal stress and deformation due to thermal expansion or thermal contraction. SOLUTION: The upper lid part of a cooling device 1, which comprises the upper lid part and a lower lid part, is composed of an aluminum material 2 and a metal matrix composite positioned on a surface side, with a fin being provided on an inner surface side. The metal matrix composite is arranged as metal matrix composites 3u to 3z, divided to six pieces, at a part to which insulating substrates 4u to 4z, to which switching elements of each phase are attached, are fitted. Since the metal matrix composite is divided into a plurality of pieces (six pieces), even if deformation occurs due to the difference in thermal expansion factors between the aluminium material 2 and the metal matrix composites 3u to 3z, since the amount of deformation at the peripheral part of the metal matrix composite is relaxed to suppress thermal stress, cracks are prevented.
|
