发明名称 METHOD OF POSITIONING AND INSPECTING TREATMENT PART IN SEMICONDUCTOR TREATMENT APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a positioning method in which the positional relationship between a driving shaft, the tip of a needle and a part to be discharged can be obtained with satisfactory presision and to provide a method in which the mounting presision of a dispenser or the needle is digitized and inspected individually. SOLUTION: By a first fixed camera and a second camera which is integrated with a drive system, the deviation amount from an origin position of the drive system is found, and the deviation amount from the driving shaft of the tip of the needle is found by the first camera by adding an additionally obtained deviation amount.
申请公布号 JP2002368025(A) 申请公布日期 2002.12.20
申请号 JP20010169549 申请日期 2001.06.05
申请人 TDK CORP 发明人 OTSU YOSHIFUMI;ONOZEKI YOSHIHIRO;NAKAYAMA SHOICHI;MIZUNO TORU
分类号 B05D1/26;B05D3/00;H01L21/027;H01L21/56;(IPC1-7):H01L21/56 主分类号 B05D1/26
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