发明名称 PRINTED-WIRING BOARD INSPECTION APPARATUS
摘要 PROBLEM TO BE SOLVED: To obtain a printed-wiring board inspection apparatus for improving productivity by reducing inspection time. SOLUTION: At the lower portion of a chain conveyor 24 being provided in a heating chamber 22 of a reflow apparatus 12, a component-carrying conveyor 50 is provided for accepting falling-off components 49 from a printed- wiring board 31 to be carried to the chain conveyor 24 for carrying to a tray 52. The falling-off components 49 being collected by the tray 52 are detected by a photosensor 54, and a photosensor 82 being provided between the reflow apparatus 12 and an outer shape inspection apparatus 14 is operated based on the detection result, thus specifying the printed-wiring board 32 being fed from the reflow apparatus 12. Specific information on the board by the photosensor 82 is transmitted to the outer shape inspection apparatus 14. When a board where components have fallen off is carried into the outer shape inspection apparatus 14, the fail board is transferred to a non-conforming article stocker 78.
申请公布号 JP2002368500(A) 申请公布日期 2002.12.20
申请号 JP20010168336 申请日期 2001.06.04
申请人 FUJI PHOTO FILM CO LTD 发明人 OTAKA HIROYUKI
分类号 G01N21/956;B23K1/00;B23K1/008;H05K3/00;H05K3/34;H05K13/08 主分类号 G01N21/956
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