| 摘要 |
PROBLEM TO BE SOLVED: To provide a flip-chip mounting method in which a printed-wiring board unit of high reliability can be manufactured at low costs. SOLUTION: A tin plated layer 6 is formed on electrodes on a circuit board, e.g. on copper electrodes 11 on a printed-wiring board 1, gold bumps 21 which are formed on electrodes (not indicated in the Fig.) of an IC chip 2 and the tin plated layer 6 are pressurized in a heated state at the melting point or less of tin. A gold-tin alloy layer 7 is generated by a solid-phase reaction, and the IC chip 2 is flip-chip-mounted on the printed-wiring board 1. The layer 6 can be formed as a tin plated layer containing copper. |
