ELECTRONIC COMPONENT, ITS THERMAL EXPANSION CONTROLLING MEMBER AND THERMAL EXPANSION CONTROLLING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a member for controlling thermal expansion of an electronic component in which difference of thermal expansion can be minimized between an electronic component and a printed board. SOLUTION: The member 3 for controlling thermal expansion of an electronic component is secured above, below or around an electronic component 1 mounted on a printed board 5 and has a function for bringing thermal expansion of the electronic component close to that of the printed board 5.