| 摘要 |
PROBLEM TO BE SOLVED: To provide semiconductor wafers, which can be raised in their identification rate even though a surface treatment of the wafers is performed, and to provide a method of identifying the wafers and a semiconductor wafer identifying apparatus using that method. SOLUTION: The semiconductor wafers are identified by using the wafers each having identifying marks, which are related to a plurality of the previously set angles of rotation at the time when the wafers are rotated around their centers and are formed on the circumferences of the circles formed by rotating the wafers, by irradiating the circumferences of the wafers with illuminating light while these wafers are rotated, and by receiving the reflected light on the wafers to detect the presence or absence of the marks by an increase or decrease of the quantity of the reflected light.
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