发明名称 CHIP-TYPE ELECTRONIC COMPONENT AND METHOD FOR APPLYING CONDUCTIVE PASTE ON THE SAME
摘要 PROBLEM TO BE SOLVED: To generate a gap easily between a side electrode and a component body in a baking process since a middle section becomes thicker than each end section of the side electrode due to the surface tension of the conductive paste when the side electrode being extended in a strip on the side of the component body is formed by imparting the conductive paste or baking. SOLUTION: Width W2 in the middle section is narrowed as compared with width W1 in each end section of the side electrodes 29 and 30 to reduce the protuberence of the conductive paste due to surface tension, thus thinning the imparting thickness of the conductive paste at the middle section of the side electrodes 29 and 30 and preventing a gap from being generated easily between the sides 29 and 30, and a component body 22 in a burning process.
申请公布号 JP2002367851(A) 申请公布日期 2002.12.20
申请号 JP20010176847 申请日期 2001.06.12
申请人 MURATA MFG CO LTD 发明人 TAKASHIMA HIROYOSHI
分类号 H01G4/12;H01G13/00;(IPC1-7):H01G4/12 主分类号 H01G4/12
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