发明名称 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To properly supply a resin film to a pellet bonding area. SOLUTION: Before a collet 33 transfers the resin film 6 to a land 13, the angle of inclination with reference to the land 13 of the resin film 6 is corrected so as to align the resin film 6 with the land 13. A suction port 35 in the collet 33 is opened and formed on the conical surface of a suction face 34, and a folding part 8 due to the suction of the suction port 35 is formed in the peripheral part of the resin film 6 so as to prevent an airtight space from being formed in the contact face of the resin film 6 with the land 13 due to the folding part 8. When the resin film 6 is thermocompression-bonded to the land 13 by a pressure tool 44, air or gas inside a space formed in the peripheral part of the resin film 6 and the land 13 is evacuated to around the center, and a phenomenon that a void is generated in a bonding layer 7 is prevented. Consequently, the resin film is prevented from being hooked on an internal terminal, and a proper wire bonding operation is ensured. Generation of the void in the bonding layer is prevented, and a crack can be prevented.
申请公布号 JP2002368023(A) 申请公布日期 2002.12.20
申请号 JP20010170968 申请日期 2001.06.06
申请人 HITACHI LTD;HITACHI TOKYO ELECTRONICS CO LTD 发明人 TAKANO RYUICHI;MAKI HIROSHI;MAKITA YOSHIAKI
分类号 H01L21/52 主分类号 H01L21/52
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