发明名称 METHOD AND APPARATUS FOR FIXING FINE COMPONENT TO SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a method for fixing fine components or the like accurately by a suction alignment adhesion method that performs alignment while recognizing the mounting position of sucked fine components or the like and performs adhesion fixation in alignment adhesion fixation accompanied by the miniaturization and complexity of electronic components. SOLUTION: A window 6 for transmitting light to a mechanism for sucking fine components 5 and a suction pad 7 are incorpozated to simultaneously recognizing the positions of the fine component 5 and a substrate 4. By providing a method for performing alignment and at the same time UV irradiation, a method for preventing position deviation or the like from being generated and at the same time fixing fine components or the like accurately is obtained.
申请公布号 JP2002368496(A) 申请公布日期 2002.12.20
申请号 JP20010178065 申请日期 2001.06.13
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 IMADA YUKIO
分类号 H05K13/04;H01L21/52;H05K13/08 主分类号 H05K13/04
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