发明名称 SEMICONDUCTOR CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR
摘要 PROBLEM TO BE SOLVED: To obtain a semiconductor circuit board, having an electromagnetic noise suppressor formed with an insulation film interposed which can effectively absorb jamming electromagnetic waves, ranging from MHz bands to GHz bands and reveal an electromagnetic wave absorption effect, when it is divided into individual semiconductor elements. SOLUTION: The semiconductor circuit board has an electromagnetic noise suppressor 4 formed from a soft magnetic film formed through an insulation film at a specified position on an IC circuit pattern 11 covered with an insulation film 9, and the noise suppressor 4 is formed over the entire surface of the IC circuit pattern via the insulation film 9 and processed into a fine pattern, having at least a size which is not greater than minimum widths of power lines 2 and ground lines 3 of the IC circuit pattern.
申请公布号 JP2002368101(A) 申请公布日期 2002.12.20
申请号 JP20010168347 申请日期 2001.06.04
申请人 NEC TOKIN CORP 发明人 YOSHIDA EIKICHI;ONO YUJI;YAMANAKA EIJI;NEMOTO MICHIO
分类号 H05K9/00;H01L21/822;H01L27/04;(IPC1-7):H01L21/822 主分类号 H05K9/00
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