发明名称 METHOD OF FORMING SUPERCONDUCTIVE WIRING
摘要 PROBLEM TO BE SOLVED: To provide a method of forming a superconductive wiring, capable of forming superconductive wiring on surfaces of arbitrary shape, such as curved surfaces and the like, other than flat planes. SOLUTION: The method comprises steps of forming a conductive pattern on a substrate surface; subjecting it to migration electrodeposition or electrocrystallizing high-temperature superconducting particulates and/or high- temperature superconducting precursor substance particulates on the superconducting pattern; and forming the superconducting wiring, by heat treating the substrate to sinter the particulates.
申请公布号 JP2002368296(A) 申请公布日期 2002.12.20
申请号 JP20010168551 申请日期 2001.06.04
申请人 JAPAN SCIENCE & TECHNOLOGY CORP 发明人 KAWACHI MASAHARU;SATO SHIGEYOSHI;YOSHIZAWA MASATO
分类号 H01L21/288;H01L21/3205;H01L23/52;H01L39/24;(IPC1-7):H01L39/24;H01L21/320 主分类号 H01L21/288
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