发明名称 |
METHOD OF FORMING SUPERCONDUCTIVE WIRING |
摘要 |
PROBLEM TO BE SOLVED: To provide a method of forming a superconductive wiring, capable of forming superconductive wiring on surfaces of arbitrary shape, such as curved surfaces and the like, other than flat planes. SOLUTION: The method comprises steps of forming a conductive pattern on a substrate surface; subjecting it to migration electrodeposition or electrocrystallizing high-temperature superconducting particulates and/or high- temperature superconducting precursor substance particulates on the superconducting pattern; and forming the superconducting wiring, by heat treating the substrate to sinter the particulates.
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申请公布号 |
JP2002368296(A) |
申请公布日期 |
2002.12.20 |
申请号 |
JP20010168551 |
申请日期 |
2001.06.04 |
申请人 |
JAPAN SCIENCE & TECHNOLOGY CORP |
发明人 |
KAWACHI MASAHARU;SATO SHIGEYOSHI;YOSHIZAWA MASATO |
分类号 |
H01L21/288;H01L21/3205;H01L23/52;H01L39/24;(IPC1-7):H01L39/24;H01L21/320 |
主分类号 |
H01L21/288 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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